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  • Tantalum Carbide TaC Coated Halfmoon

    • China Tantalum Carbide TaC Coated Halfmoon Manufacturer, Supplier, Factory

    As a professional Tantalum Carbide TaC Coated Halfmoon manufacturer and supplier in China, we have our own factory. Whether you need customized services to meet the specific needs of your region or want to buy advanced and durable Tantalum Carbide TaC Coated Halfmoon made in China, you can leave us a message.

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    • Silicon Carbide Wafer Chuck

      Silicon Carbide Wafer Chuck

      As a leading manufacturer and supplier of Silicon Carbide Wafer Chuck products in China, VeTek Semiconductor's Silicon Carbide Wafer Chuck plays an irreplaceable role in the epitaxial growth process with its excellent high temperature resistance, chemical corrosion resistance and thermal shock resistance. Welcome your further consultation.
    • Quartz Wafer Boat

      Quartz Wafer Boat

      As a professional quartz wafer boat manufacturer and supplier in China, Vetek Semiconductor Quartz Wafer Boat is designed to exceed industry standards and optimize your production process. Our quartz wafer boats are carefully designed and highly reliable to meet the stringent requirements of the semiconductor industry. Vetek Semiconductor is committed to providing advanced technology and product solutions for the semiconductor industry. We welcome your further inquiries.
    • TaC Coating Tube

      TaC Coating Tube

      As a professional TaC Coating Tube manufacturer and supplier in China, VeTek Semiconductor's TaC coating tube is a key component for the successful growth of silicon carbide single crystals. With its high temperature resistance, chemical inertness and excellent performance, it ensures the production of high-quality crystals with consistent results. Trust our innovative solutions to enhance your PVT method SiC crystal growth process and achieve excellent results.Welcome to inquiry us.
    • Soft Felt Or Furnace Heat Insulation

      Soft Felt Or Furnace Heat Insulation

      VeTek Semiconductor is committed to providing high-quality Soft Felt or Furnace Heat Insulation. It is made of carbon fiber or graphite fiber interwoven with each other, and has excellent thermal insulation and high temperature resistance. Whether it is in industrial heating furnaces, high-temperature equipment or other occasions that require thermal insulation, our Soft Felt or Furnace Heat Insulation can meet your needs. VeTek Semiconductor looks forward to establishing a long-term cooperative relationship with you.
    • Silicon Carbide Seal Ring

      Silicon Carbide Seal Ring

      As a professional Silicon Carbide Seal Ring product manufacturer and factory in China, VeTek Semiconductor Silicon Carbide Seal Ring is widely used in semiconductor processing equipment due to its excellent heat resistance, corrosion resistance, mechanical strength and thermal conductivity. It is especially suitable for processes involving high temperature and reactive gases such as CVD, PVD and plasma etching, and is a key material choice in the semiconductor manufacturing process. Your further inquiries are welcome.
    • SiC Coating Epi susceptor

      SiC Coating Epi susceptor

      VeTek Semiconductor is a leading manufacturer, innovator and leader of SiC Coating Epi Susceptor products in China. For many years, we have been focusing on various SiC Coating products such as SiC Coating Epi Susceptor, SiC Coating Wafer Carrier, SiC Coating Susceptor, SiC coating ALD susceptor, etc. VeTek Semiconductor is committed to providing advanced technology and product solutions for the semiconductor industry. Welcome your further consultation.
    • Related Blog
    • Reviews

    • Chip manufacturing: A process flow of MOSFET

      The chip manufacturing process includes photolithography,etching, diffusion, thin film, ion implantation, chemical mechanical polishing, cleaning, etc. This article roughly explains how these processes are integrated in sequence to manufacture a MOSFET.

    • What is CVD TAC Coating?

      CVD TAC coating is a process for forming a dense and durable coating on a substrate (graphite). This method involves depositing TaC onto the substrate surface at high temperatures, resulting in a tantalum carbide (TaC) coating with excellent thermal stability and chemical resistance.

    • Silicon(Si) epitaxy preparation technology

      Single crystal materials alone cannot meet the needs of the growing production of various semiconductor devices. At the end of 1959, a thin layer of single crystal material growth technology - epitaxial growth was developed.

    • Chip Manufacturing: Atomic Layer Deposition (ALD)

      In the semiconductor manufacturing industry, as device size continues to shrink, the deposition technology of thin film materials has posed unprecedented challenges. Atomic Layer Deposition (ALD), as a thin film deposition technology that can achieve precise control at the atomic level, has become an indispensable part of semiconductor manufacturing. This article aims to introduce the process flow and principles of ALD to help understand its important role in advanced chip manufacturing.

    • Exploratory application of 3D printing technology in the semiconductor industry

      In an era of rapid technological development, 3D printing, as an important representative of advanced manufacturing technology, is gradually changing the face of traditional manufacturing. With the continuous maturity of technology and the reduction of costs, 3D printing technology has shown broad application prospects in many fields such as aerospace, automobile manufacturing, medical equipment, and architectural design, and has promoted the innovation and development of these industries.

    • What is the difference between epitaxy and ALD?

      The main difference between epitaxy and atomic layer deposition (ALD) lies in their film growth mechanisms and operating conditions. Epitaxy refers to the process of growing a crystalline thin film on a crystalline substrate with a specific orientation relationship, maintaining the same or similar crystal structure. In contrast, ALD is a deposition technique that involves exposing a substrate to different chemical precursors in sequence to form a thin film one atomic layer at a time.

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