Semiconductor Ceramic Nozzle

Semiconductor ceramic nozzle plays an important role in the HDP-CVD process, used to precisely control gas flow and ensure high-quality film deposition. Ceramic nozzle spray is precisely engineered to ensure consistent and controllable gas flow rates, minimizing possible turbulence when the gas enters the reaction chamber.

Technical Specifications:

1.Material Composition:

VeTeK Semiconductor Ceramic sand blasting nozzle are typically made of Semiconductor ceramics such as aluminum oxide (Al2O3), silicon carbide (SiC), or zirconium oxide (ZrO2),these materials have excellent properties:

    • high thermal stability (can withstand temperatures above 1000℃)

    • resistance to corrosion by reactive gases used in CVD processes (such as silane, ammonia)

    • resistance to continuous plasma exposure.

2. Structural Design:

    • Orifice Size: The orifice of the Semiconductor ceramic nozzle is scientifically designed to enable precise control of gas flow, which in turn affects the uniformity and thickness of the film.

    • Angles and Geometries: Precisely designed to ensure uniform gas distribution across the substrate, minimizing defects in the deposited layer.

In the semiconductor industry, Semiconductor ceramic blast nozzle play a key role primarily in the HDP-CVD process. They are also used to deposit thin films for the production of microelectronics, ensuring high-quality surface coatings that are uniform and free of contaminants.

VeTeK Semiconductor Ceramic Nozzle shops: