Wafer Handling Robotic Arm

Vetek Semiconductor is professional in wafer handling robotic arm made by thermal spraying technology.

1.Thermal spraying technology can effectively improve the wear resistance of the robot arm. The wafer handling robot arm frequently contacts wafers and other equipment during operation. This high-frequency contact and movement can easily cause wear of mechanical parts. By spraying wear-resistant materials on the surface of the robot arm, the wear of the parts can be greatly reduced, the service life of the robot arm can be extended, and the maintenance cost can be reduced.

2.The improvement of corrosion resistance is also a significant advantage of thermal spraying technology. In the semiconductor manufacturing process, the robot arm needs to work in an environment full of corrosive gases and chemical reagents. These chemicals may corrode the robot arm, affecting its performance and precision. Thermal spraying technology can form a dense anti-corrosion coating on the surface of the robot arm, effectively preventing the invasion of corrosive substances, thereby ensuring the stable operation of the robot arm in harsh environments.

3.Thermal spraying technology can also enhance the thermal stability of the robot arm. In the semiconductor manufacturing process, some processes will generate high temperatures, and the robot arm must maintain precise operation in a high temperature environment. Thermal spraying technology ensures that the robot arm does not deform or degrade at high temperatures by coating the surface of the robot arm with materials with high temperature stability, thereby improving the reliability and precision of the overall production line.

4.The application of antistatic coating further improves the performance of the robot arm. Wafers are very sensitive to static electricity, and the accumulation of static electricity may cause contamination of the wafer surface or damage to electronic devices. Through thermal spraying technology, an antistatic coating can be formed on the surface of the robot arm, which effectively reduces the generation of static electricity, protects the wafer from damage by static electricity, and ensures the quality and safety of the product.

5. Thermal spraying technology can also reduce particle contamination of the robot arm during operation. In semiconductor manufacturing, any tiny particle contamination may affect the quality of the wafer. By using thermal spraying technology, a smooth and dense coating can be formed on the surface of the robot arm, reducing the shedding of particles, maintaining the cleanliness of the production environment, and thus improving the yield of the product.