Horizontal SiC Wafer Carrier

VeTek Semiconductor’s Horizontal SiC Wafer Carrier/Boat has an extremely high melting point (about 2700°C), which enables the Horizontal SiC Wafer Carrier/Boat to work stably in high temperature environments without deformation or degradation. This feature is particularly important in the semiconductor manufacturing process, especially in processes such as high-temperature annealing or chemical vapor deposition (CVD).

The Horizontal SiC Wafer Carrier/Boat specifically plays the following roles in the process of carrying wafer carriers:

Silicon wafer carrying and support: The Horizontal SiC Wafer Boat is mainly used to carry and support silicon wafers during semiconductor manufacturing. It can firmly arrange multiple silicon wafers together to ensure that they remain in good position and stability throughout the entire processing process.

Uniform heating and cooling: Due to the high thermal conductivity of SiC, the Wafer Boat can effectively distribute heat evenly to all silicon wafers. This helps achieve uniform heating or cooling of silicon wafers during high-temperature processing, ensuring consistency and reliability of the processing process.

Prevent contamination: The chemical stability of SiC enables it to perform well in high-temperature and corrosive gas environments, thereby reducing the exposure of silicon wafers to possible contaminants or reactants, ensuring the purity and quality of silicon wafers.

In fact, the Horizontal SiC Wafer Boat can play the above role due to its unique product characteristics:

Excellent chemical stability: SiC material has excellent corrosion resistance to a variety of chemical media. In the process of processing corrosive gases or liquids, SiC Wafer Boat can effectively resist chemical corrosion and protect silicon wafers from contamination or damage.

High thermal conductivity: SiC's high thermal conductivity helps to evenly distribute heat in the carrier process and reduce heat accumulation. This can improve the accuracy of temperature control during precision processing and ensure uniform heating or cooling of silicon wafers.

Low thermal expansion coefficient: The low thermal expansion coefficient of SiC material means that the dimensional change of SiC Wafer Boat is very small during temperature changes. This helps maintain dimensional stability during high-temperature processing and prevents deformation or positional displacement of silicon wafers caused by thermal expansion.

Basic physical properties of Horizontal SiC Wafer Carrier:

VeTek Semiconductor Production Shop:

Overview of the semiconductor chip epitaxy industry chain: