What measurement equipment are there in the Fab factory? - VeTek semiconductor

There are many types of measurement equipment in the Fab factory. The following are some common equipment:

Photolithography process measurement equipment

• Photolithography machine alignment accuracy measurement equipment: such as ASML's alignment measurement system, which can ensure the accurate superposition of different layer patterns.

• Photoresist thickness measurement instrument: including ellipsometers, etc., which calculate the thickness of photoresist based on the polarization characteristics of light.

• ADI t and AEI detection equipment: detect the photoresist development effect and pattern quality after photolithography, such as the relevant detection equipment of Vip Optoelectronics.

Etching process measurement equipment

• Etching depth measurement equipment: such as white light interferometer, which can accurately measure the slight changes in etching depth.

• Etching profile measurement instrument: use electron beam or optical imaging technology to measure the profile information such as the side wall angle of the pattern after etching.

• CD-SEM: can accurately measure the size of microstructures such as transistors.

Thin film deposition process measurement equipment

• Film thickness measuring instruments: such as optical reflectometers, X-ray reflectometers, etc., can measure the thickness of various films deposited on the surface of the wafer.

• Film stress measuring equipment: By measuring the stress generated by the film on the wafer surface, the quality of the film and its potential impact on the wafer performance are judged.

Doping process measuring equipment

• Ion implantation dose measuring equipment: Determine the ion implantation dose by monitoring parameters such as beam intensity during ion implantation or performing electrical tests on the wafer after implantation.

• Doping concentration and distribution measuring equipment: For example, secondary ion mass spectrometers (SIMS) and spreading resistance probes (SRP) can measure the concentration and distribution of doping elements in the wafer.

CMP process measuring equipment

• Post-polishing flatness measuring equipment: Use optical profilometers and other equipment to measure the flatness of the wafer surface after polishing.

• Polishing removal measuring equipment: Determine the amount of material removed during polishing by measuring the depth or thickness change of a mark on the wafer surface before and after polishing.

Wafer particle detection equipment

• KLA SP 1/2/3/5/7 and other equipment: can effectively detect particle contamination on the wafer surface.

• TORNADO series: TORNADO series equipment of Vip Optoelectronics can detect defects such as particles on the wafer, generate defect maps, and feedback to related processes for adjustment.

• ALFA-X intelligent visual inspection equipment: through the CCD-AI image control system, use displacement and visual sensing technology to distinguish wafer images and detect defects such as particles on the wafer surface.

Other measuring equipment

• Optical microscope: used to observe the microstructure and defects on the wafer surface.

• Scanning electron microscope (SEM): can provide higher resolution images for observing the microscopic morphology of the wafer surface.

• Atomic force microscope (AFM): can measure information such as the roughness of the wafer surface.

• Ellipsometer: in addition to measuring the thickness of photoresist, it can also be used to measure parameters such as the thickness and refractive index of thin films.

• Four-probe tester: used to measure electrical performance parameters such as the resistivity of the wafer.

• X-ray diffractometer (XRD): can analyze the crystal structure and stress state of wafer materials.

• X-ray photoelectron spectrometer (XPS): used to analyze the elemental composition and chemical state of the wafer surface.

• Focused ion beam microscope (FIB): can perform micro-nano processing and analysis on wafers.

• Macro ADI equipment: such as Circle machine, used for macro detection of pattern defects after lithography.

• Mask defect detection equipment: detect defects on the mask to ensure the accuracy of the lithography pattern.

• Transmission electron microscope (TEM): can observe the microstructure and defects inside the wafer.

• Wireless temperature measurement wafer sensor: suitable for a variety of process equipment, measuring temperature accuracy and uniformity.